Programming DNA origami patterning with non-canonical DNA-based metallization reactions

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  • Sisi Jia, Shanghai Jiaotong University, Chinese Academy of Sciences
  • ,
  • Jianbang Wang, Chinese Academy of Sciences
  • ,
  • Mo Xie, Chinese Academy of Sciences
  • ,
  • Jixue Sun, Nankai University
  • ,
  • Huajie Liu, School of Chemical Science and Engineering, Tongji University
  • ,
  • Yinan Zhang, Chinese Academy of Sciences
  • ,
  • Jie Chao, Nanjing University of Posts and Telecommunications
  • ,
  • Jiang Li, Chinese Academy of Sciences, Shanghai Advanced Research Institute, Chinese Academy of Sciences
  • ,
  • Lihua Wang, Chinese Academy of Sciences, East China Normal University
  • ,
  • Jianping Lin, Nankai University
  • ,
  • Kurt V. Gothelf
  • Chunhai Fan, Shanghai Jiaotong University

The inherent specificity of DNA sequence hybridization has been extensively exploited to develop bioengineering applications. Nevertheless, the structural potential of DNA has been far less explored for creating non-canonical DNA-based reactions. Here we develop a DNA origami-enabled highly localized metallization reaction for intrinsic metallization patterning with 10-nm resolution. Both theoretical and experimental studies reveal that low-valence metal ions (Cu2+ and Ag+) strongly coordinate with DNA bases in protruding clustered DNA (pcDNA) prescribed on two-dimensional DNA origami, which results in effective attraction within flexible pcDNA strands for site-specific pcDNA condensation. We find that the metallization reactions occur selectively on prescribed sites while not on origami substrates. This strategy is generically applicable for free-style metal painting of alphabet letters, digits and geometric shapes on all−DNA substrates with near-unity efficiency. We have further fabricated single- and double-layer nanoscale printed circuit board (nano-PCB) mimics, shedding light on bio-inspired fabrication for nanoelectronic and nanophotonic applications.

Original languageEnglish
Article number5597
JournalNature Communications
Volume10
Issue1
ISSN2041-1723
DOIs
Publication statusPublished - 1 Dec 2019

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