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Final published version
Neuromorphic computing could pave the way to a new generation of smart sensors that can process signals locally through Spiking Neural Networks (SNNs). For this paradigm to take hold, it is necessary to have an analog-to-spike encoder adaptable to a wide range of applications. The encoding system should offer the possibility to try different encoding algorithms, giving freedom to the designers to select the most appropriate approach for the target task. At the same time, it should feature a tunable parameter to modulate the spike density, in the pursuit of a compromise between accuracy and power consumption. Therefore, the goal of this work is to provide a platform enabling the conversion of analog signals to a sequence of spikes, characterized by flexibility, high energy efficiency, and small area. We introduce an encoder designed and simulated in a standard 0.18 μm CMOS process which benefits from a switch-capacitor and a dynamic comparator to achieve very high energy efficiency. The controller unit can switch between Slope-based or Step-Forward Encoding algorithms. The encoder consumes 30 fJ/spike at 1.5 V supply voltage and occupies an area of 0.00325
Original language | English |
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Title of host publication | 2021 IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Proceedings |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Publication year | 2021 |
Article number | 9401103 |
ISBN (electronic) | 9781728192017 |
DOIs | |
Publication status | Published - 2021 |
Event | 53rd IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Daegu, Korea, Republic of Duration: 22 May 2021 → 28 May 2021 |
Conference | 53rd IEEE International Symposium on Circuits and Systems, ISCAS 2021 |
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Land | Korea, Republic of |
By | Daegu |
Periode | 22/05/2021 → 28/05/2021 |
Series | Proceedings - IEEE International Symposium on Circuits and Systems |
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Volume | 2021-May |
ISSN | 0271-4310 |
Funding Information:
This work was supported by the project HERMES, that received funding from the European Union's Horizon 2020 research and innovation program under grant agreement No 824164.
Funding Information:
This work was supported by the project HERMES, that received funding from the European Union’s Horizon 2020 research and innovation program under grant agreement No 824164.
Publisher Copyright:
© 2021 IEEE
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