Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper

Research output: Contribution to journal/Conference contribution in journal/Contribution to newspaperJournal articleResearchpeer-review

Standard

Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper. / Kadumudi, Firoz Babu; Trifol, Jon; Jahanshahi, Mohammadjavad; Zsurzsan, Tiberiu Gabriel; Mehrali, Mehdi; Zeqiraj, Eva; Shaki, Hossein; Alehosseini, Morteza; Gundlach, Carsten; Li, Qiang; Dong, Mingdong; Akbari, Mohsen; Knott, Arnold; Almdal, Kristoffer; Dolatshahi-Pirouz, Alireza.

In: ACS applied materials & interfaces, Vol. 12, No. 42, 10.2020, p. 48027-48039.

Research output: Contribution to journal/Conference contribution in journal/Contribution to newspaperJournal articleResearchpeer-review

Harvard

Kadumudi, FB, Trifol, J, Jahanshahi, M, Zsurzsan, TG, Mehrali, M, Zeqiraj, E, Shaki, H, Alehosseini, M, Gundlach, C, Li, Q, Dong, M, Akbari, M, Knott, A, Almdal, K & Dolatshahi-Pirouz, A 2020, 'Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper', ACS applied materials & interfaces, vol. 12, no. 42, pp. 48027-48039. https://doi.org/10.1021/acsami.0c15326

APA

Kadumudi, F. B., Trifol, J., Jahanshahi, M., Zsurzsan, T. G., Mehrali, M., Zeqiraj, E., Shaki, H., Alehosseini, M., Gundlach, C., Li, Q., Dong, M., Akbari, M., Knott, A., Almdal, K., & Dolatshahi-Pirouz, A. (2020). Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper. ACS applied materials & interfaces, 12(42), 48027-48039. https://doi.org/10.1021/acsami.0c15326

CBE

Kadumudi FB, Trifol J, Jahanshahi M, Zsurzsan TG, Mehrali M, Zeqiraj E, Shaki H, Alehosseini M, Gundlach C, Li Q, Dong M, Akbari M, Knott A, Almdal K, Dolatshahi-Pirouz A. 2020. Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper. ACS applied materials & interfaces. 12(42):48027-48039. https://doi.org/10.1021/acsami.0c15326

MLA

Vancouver

Kadumudi FB, Trifol J, Jahanshahi M, Zsurzsan TG, Mehrali M, Zeqiraj E et al. Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper. ACS applied materials & interfaces. 2020 Oct;12(42):48027-48039. https://doi.org/10.1021/acsami.0c15326

Author

Kadumudi, Firoz Babu ; Trifol, Jon ; Jahanshahi, Mohammadjavad ; Zsurzsan, Tiberiu Gabriel ; Mehrali, Mehdi ; Zeqiraj, Eva ; Shaki, Hossein ; Alehosseini, Morteza ; Gundlach, Carsten ; Li, Qiang ; Dong, Mingdong ; Akbari, Mohsen ; Knott, Arnold ; Almdal, Kristoffer ; Dolatshahi-Pirouz, Alireza. / Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper. In: ACS applied materials & interfaces. 2020 ; Vol. 12, No. 42. pp. 48027-48039.

Bibtex

@article{63762b6c68bd4d79b8bdc57a4efae465,
title = "Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper",
abstract = "Today's consumer electronics are made from nonrenewable and toxic components. They are also rigid, bulky, and manufactured in an energy-inefficient manner via CO2-generating routes. Though petroleum-based polymers such as polyethylene terephthalate and polyethylene naphthalate can address the rigidity issue, they have a large carbon footprint and generate harmful waste. Scalable routes for manufacturing electronics that are both flexible and ecofriendly (Fleco) could address the challenges in the field. Ideally, such substrates must incorporate into electronics without compromising device performance. In this work, we demonstrate that a new type of wood-based [nanocellulose (NC)] material made via nanosilicate (NS) reinforcement can yield flexible electronics that can bend and roll without loss of electrical function. Specifically, the NSs interact electrostatically with NC to reinforce thermal and mechanical properties. For instance, films containing 34 wt % of NS displayed an increased young's modulus (1.5 times), thermal stability (290 → 310 °C), and a low coefficient of thermal expansion (40 ppm/K). These films can also easily be separated and renewed into new devices through simple and low-energy processes. Moreover, we used very cheap and environmentally friendly NC from American Value Added Pulping (AVAP) technology, American Process, and therefore, the manufacturing cost of our NS-reinforced NC paper is much cheaper ($0.016 per dm-2) than that of conventional NC-based substrates. Looking forward, the methodology highlighted herein is highly attractive as it can unlock the secrets of Fleco electronics and transform otherwise bulky, rigid, and {"}difficult-to-process{"} rigid circuits into more aesthetic and flexible ones while simultaneously bringing relief to an already-overburdened ecosystem.",
keywords = "circular economy, flexible electronics, green electronics, nanocellulose, nanosilicate, origami electronics",
author = "Kadumudi, {Firoz Babu} and Jon Trifol and Mohammadjavad Jahanshahi and Zsurzsan, {Tiberiu Gabriel} and Mehdi Mehrali and Eva Zeqiraj and Hossein Shaki and Morteza Alehosseini and Carsten Gundlach and Qiang Li and Mingdong Dong and Mohsen Akbari and Arnold Knott and Kristoffer Almdal and Alireza Dolatshahi-Pirouz",
year = "2020",
month = oct,
doi = "10.1021/acsami.0c15326",
language = "English",
volume = "12",
pages = "48027--48039",
journal = "A C S Applied Materials and Interfaces",
issn = "1944-8244",
publisher = "American Chemical Society",
number = "42",

}

RIS

TY - JOUR

T1 - Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper

AU - Kadumudi, Firoz Babu

AU - Trifol, Jon

AU - Jahanshahi, Mohammadjavad

AU - Zsurzsan, Tiberiu Gabriel

AU - Mehrali, Mehdi

AU - Zeqiraj, Eva

AU - Shaki, Hossein

AU - Alehosseini, Morteza

AU - Gundlach, Carsten

AU - Li, Qiang

AU - Dong, Mingdong

AU - Akbari, Mohsen

AU - Knott, Arnold

AU - Almdal, Kristoffer

AU - Dolatshahi-Pirouz, Alireza

PY - 2020/10

Y1 - 2020/10

N2 - Today's consumer electronics are made from nonrenewable and toxic components. They are also rigid, bulky, and manufactured in an energy-inefficient manner via CO2-generating routes. Though petroleum-based polymers such as polyethylene terephthalate and polyethylene naphthalate can address the rigidity issue, they have a large carbon footprint and generate harmful waste. Scalable routes for manufacturing electronics that are both flexible and ecofriendly (Fleco) could address the challenges in the field. Ideally, such substrates must incorporate into electronics without compromising device performance. In this work, we demonstrate that a new type of wood-based [nanocellulose (NC)] material made via nanosilicate (NS) reinforcement can yield flexible electronics that can bend and roll without loss of electrical function. Specifically, the NSs interact electrostatically with NC to reinforce thermal and mechanical properties. For instance, films containing 34 wt % of NS displayed an increased young's modulus (1.5 times), thermal stability (290 → 310 °C), and a low coefficient of thermal expansion (40 ppm/K). These films can also easily be separated and renewed into new devices through simple and low-energy processes. Moreover, we used very cheap and environmentally friendly NC from American Value Added Pulping (AVAP) technology, American Process, and therefore, the manufacturing cost of our NS-reinforced NC paper is much cheaper ($0.016 per dm-2) than that of conventional NC-based substrates. Looking forward, the methodology highlighted herein is highly attractive as it can unlock the secrets of Fleco electronics and transform otherwise bulky, rigid, and "difficult-to-process" rigid circuits into more aesthetic and flexible ones while simultaneously bringing relief to an already-overburdened ecosystem.

AB - Today's consumer electronics are made from nonrenewable and toxic components. They are also rigid, bulky, and manufactured in an energy-inefficient manner via CO2-generating routes. Though petroleum-based polymers such as polyethylene terephthalate and polyethylene naphthalate can address the rigidity issue, they have a large carbon footprint and generate harmful waste. Scalable routes for manufacturing electronics that are both flexible and ecofriendly (Fleco) could address the challenges in the field. Ideally, such substrates must incorporate into electronics without compromising device performance. In this work, we demonstrate that a new type of wood-based [nanocellulose (NC)] material made via nanosilicate (NS) reinforcement can yield flexible electronics that can bend and roll without loss of electrical function. Specifically, the NSs interact electrostatically with NC to reinforce thermal and mechanical properties. For instance, films containing 34 wt % of NS displayed an increased young's modulus (1.5 times), thermal stability (290 → 310 °C), and a low coefficient of thermal expansion (40 ppm/K). These films can also easily be separated and renewed into new devices through simple and low-energy processes. Moreover, we used very cheap and environmentally friendly NC from American Value Added Pulping (AVAP) technology, American Process, and therefore, the manufacturing cost of our NS-reinforced NC paper is much cheaper ($0.016 per dm-2) than that of conventional NC-based substrates. Looking forward, the methodology highlighted herein is highly attractive as it can unlock the secrets of Fleco electronics and transform otherwise bulky, rigid, and "difficult-to-process" rigid circuits into more aesthetic and flexible ones while simultaneously bringing relief to an already-overburdened ecosystem.

KW - circular economy

KW - flexible electronics

KW - green electronics

KW - nanocellulose

KW - nanosilicate

KW - origami electronics

UR - http://www.scopus.com/inward/record.url?scp=85094219726&partnerID=8YFLogxK

U2 - 10.1021/acsami.0c15326

DO - 10.1021/acsami.0c15326

M3 - Journal article

C2 - 33035422

AN - SCOPUS:85094219726

VL - 12

SP - 48027

EP - 48039

JO - A C S Applied Materials and Interfaces

JF - A C S Applied Materials and Interfaces

SN - 1944-8244

IS - 42

ER -