Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper

Research output: Contribution to journal/Conference contribution in journal/Contribution to newspaperJournal articleResearchpeer-review

DOI

  • Firoz Babu Kadumudi, Technical University of Denmark
  • ,
  • Jon Trifol, Technical University of Denmark
  • ,
  • Mohammadjavad Jahanshahi, Bam University of Medical Sciences, Chabahar Maritime University
  • ,
  • Tiberiu Gabriel Zsurzsan, Technical University of Denmark
  • ,
  • Mehdi Mehrali, Technical University of Denmark
  • ,
  • Eva Zeqiraj, Technical University of Denmark
  • ,
  • Hossein Shaki, Technical University of Denmark, Tarbiat Modarres University
  • ,
  • Morteza Alehosseini, Technical University of Denmark
  • ,
  • Carsten Gundlach, Technical University of Denmark
  • ,
  • Qiang Li, Shandong University
  • ,
  • Mingdong Dong
  • Mohsen Akbari, Victoria University
  • ,
  • Arnold Knott, Technical University of Denmark
  • ,
  • Kristoffer Almdal, Technical University of Denmark
  • ,
  • Alireza Dolatshahi-Pirouz, Radboud University Nijmegen, Technical University of Denmark

Today's consumer electronics are made from nonrenewable and toxic components. They are also rigid, bulky, and manufactured in an energy-inefficient manner via CO2-generating routes. Though petroleum-based polymers such as polyethylene terephthalate and polyethylene naphthalate can address the rigidity issue, they have a large carbon footprint and generate harmful waste. Scalable routes for manufacturing electronics that are both flexible and ecofriendly (Fleco) could address the challenges in the field. Ideally, such substrates must incorporate into electronics without compromising device performance. In this work, we demonstrate that a new type of wood-based [nanocellulose (NC)] material made via nanosilicate (NS) reinforcement can yield flexible electronics that can bend and roll without loss of electrical function. Specifically, the NSs interact electrostatically with NC to reinforce thermal and mechanical properties. For instance, films containing 34 wt % of NS displayed an increased young's modulus (1.5 times), thermal stability (290 → 310 °C), and a low coefficient of thermal expansion (40 ppm/K). These films can also easily be separated and renewed into new devices through simple and low-energy processes. Moreover, we used very cheap and environmentally friendly NC from American Value Added Pulping (AVAP) technology, American Process, and therefore, the manufacturing cost of our NS-reinforced NC paper is much cheaper ($0.016 per dm-2) than that of conventional NC-based substrates. Looking forward, the methodology highlighted herein is highly attractive as it can unlock the secrets of Fleco electronics and transform otherwise bulky, rigid, and "difficult-to-process" rigid circuits into more aesthetic and flexible ones while simultaneously bringing relief to an already-overburdened ecosystem.

Original languageEnglish
JournalACS applied materials & interfaces
Volume12
Issue42
Pages (from-to)48027-48039
Number of pages13
ISSN1944-8244
DOIs
Publication statusPublished - Oct 2020

    Research areas

  • circular economy, flexible electronics, green electronics, nanocellulose, nanosilicate, origami electronics

See relations at Aarhus University Citationformats

ID: 200024473