Facilitating Performance Optimization of RF PCB Designs by using Parametric Finite-Element Component Models

John Rohde, Thomas Skjødeberg Toftegaard

    Research output: Contribution to book/anthology/report/proceedingArticle in proceedingsResearchpeer-review

    Abstract

    Novel parametric finite-element models are provided for discrete SMD capacitors and inductors in the frequency range 100 MHz to 4 GHz. The aim of the models is to facilitate performance optimization and analysis of RF PCB designs integrating these SMD components with layout geometries such as antennas and PCB traces. The models presented are benchmarked against real-life measurements and conventional circuit models. Furthermore, two example parallel-resonance circuits are designed based on interpolation of the results and validated by measurements in order to demonstrate the accuracy of the presented modelling approach.
    Original languageEnglish
    Title of host publicationVisualization, Imaging and Image Processing / 783: Modelling and Simulation / 784: Wireless Communications
    EditorsS. Al Zahir, M.H. Hamza, J. Cheng
    Number of pages5
    Volume783
    Place of publicationCanada
    PublisherACTA Press
    Publication dateJul 2012
    DOIs
    Publication statusPublished - Jul 2012
    EventThe 23rd IASTED International Conference on Modelling and Simulation - Banff, Canada
    Duration: 3 Jul 20125 Jul 2012

    Conference

    ConferenceThe 23rd IASTED International Conference on Modelling and Simulation
    Country/TerritoryCanada
    CityBanff
    Period03/07/201205/07/2012

    Keywords

    • RF circuit modelling
    • Finite-element methods
    • PCB design
    • SMD components
    • Simulation

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