Project Details
Description
SPICE intends to create a spintronic-photonic integrated circuit platform for novel electronics, which can be applied in ultrafast and energy-efficient memory or sensor technology. This goal will be achieved by combining recent scientific breakthroughs in magneto-optic materials with the emerging integrated technology platforms for silicon photonics and magnetic memory.
| Acronym | SPICE |
|---|---|
| Status | Finished |
| Effective start/end date | 01/10/2016 → 30/09/2020 |
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