Keyphrases
Improved Optimization
75%
Pulse Reverse Electrodeposition
75%
Reverse Current
50%
Direct Current
50%
Nickel Layer
25%
Nickel Electroforming
25%
Surface Roughness Prediction
25%
Metallic Layer
25%
Electroplating Process
25%
Ni Layer
25%
Micro-electro-mechanical Systems
25%
Pulse Reverse
25%
Sample Training
25%
Mapping Relationship
25%
Interlayer Properties
25%
Electroforming Process
25%
Deposition Process
25%
Output Parameters
25%
Cooling Time
15%
GA Model
12%
Systematic Design
12%
Transient Behavior
12%
Form Design
12%
Jaw Displacement
12%
Cantilever Beam
9%
Etching Rate
9%
Etch Holes
9%
Batch Processing
9%
Comb Fingers
9%
Chemical Phenomena
9%
Material Science
Microelectromechanical System
100%
Optimization Model
75%
Surface Roughness
75%
Electroplating
75%
Density
50%
Dry Etching
30%
Actuator
30%
Wet Etching
15%
Microfabrication
15%
Micromachining
15%
Surface (Surface Science)
15%
Engineering
Microgripper
75%
Genetic Algorithm
21%
Systematic Approach
21%
Electroforming
18%
Nickel Layer
18%
Etch Rate
15%
Microelectromechanical System
10%
Thin Layer
10%
Analytical Model
10%
Simulation Result
10%
Maximum Temperature
10%
Cooling Time
10%
Experimental Result
10%
Threshold Force
9%
Controllability
9%
