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Vinayak,
, Ramanujan, D, Piya, C & Ramani, K 2016,
Mobisweep: Exploring spatial design ideation using a smartphone as a hand-held reference plane. i
Proceedings of the TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction. ACM Press New York, NY, USA, s. 12-20, The Tenth ACM International conference on Tangible, Embedded and Embodied Interaction (TEI 2016), Eindhoven, Holland,
14/02/2016.
https://doi.org/10.1145/2839462.2839490
APA
Vinayak
, Ramanujan, D., Piya, C., & Ramani, K. (2016).
Mobisweep: Exploring spatial design ideation using a smartphone as a hand-held reference plane. I
Proceedings of the TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction (s. 12-20). ACM Press New York, NY, USA.
https://doi.org/10.1145/2839462.2839490
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@inproceedings{674bf29c721b4ab28499b9a0efd3bf97,
title = "Mobisweep: Exploring spatial design ideation using a smartphone as a hand-held reference plane.",
author = "Vinayak and Devarajan Ramanujan and Cecil Piya and Karthik Ramani",
year = "2016",
month = feb,
doi = "10.1145/2839462.2839490",
language = "English",
isbn = "978-1-4503-3582-9",
pages = "12--20",
booktitle = "Proceedings of the TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction",
publisher = "ACM Press New York, NY, USA",
note = "The Tenth ACM International conference on Tangible, Embedded and Embodied Interaction (TEI 2016), TEI ; Conference date: 14-02-2016 Through 17-02-2016",
url = "http://www.tei-conf.org/16/",
}
RIS
TY - GEN
T1 - Mobisweep: Exploring spatial design ideation using a smartphone as a hand-held reference plane.
AU - Vinayak, null
AU - Ramanujan, Devarajan
AU - Piya, Cecil
AU - Ramani, Karthik
PY - 2016/2
Y1 - 2016/2
U2 - 10.1145/2839462.2839490
DO - 10.1145/2839462.2839490
M3 - Article in proceedings
SN - 978-1-4503-3582-9
SP - 12
EP - 20
BT - Proceedings of the TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction
PB - ACM Press New York, NY, USA
T2 - The Tenth ACM International conference on Tangible, Embedded and Embodied Interaction (TEI 2016)
Y2 - 14 February 2016 through 17 February 2016
ER -