Material Science
Thermoelectrics
100%
Electrical Resistivity
63%
Thermoelectric Materials
59%
Thin Films
54%
Carrier Concentration
45%
Crystal Structure
31%
Pair Distribution Function Analysis
31%
Carrier Mobility
27%
Charge Carrier
24%
Density
24%
Crystalline Material
22%
Thermal Property
22%
Conductor
21%
Thermal Conductivity
19%
Hydrothermal Synthesis
18%
Doping (Additives)
18%
Magnetron Sputtering
18%
Magnetoresistance
18%
Vanadium
18%
Thermal Stability
18%
Thermochromics
18%
Oxide Compound
18%
Hall Mobility
18%
Zinc Ion
18%
Two-Dimensional Material
18%
Nanoparticle
18%
Powder X-Ray Diffraction
18%
Amorphous Material
18%
Ruthenium
18%
Physical Property
15%
Electrical Resistance
15%
Thin Film Deposition
9%
Film Thickness
9%
Tensile Strain
9%
Layered Material
9%
Structure-Directing Agent
9%
Magnetic Property
9%
Optical Property
9%
Reducing Agent
9%
Biological Material
9%
Stainless Steel
9%
Differential Scanning Calorimetry
9%
Rietveld Refinement
9%
Raman Spectroscopy
9%
Negative Thermal Expansion
9%
Energy-Dispersive X-Ray Spectroscopy
9%
Cathode
9%
Powder
9%
Spark Plasma Sintering
9%
Superlattice
9%
Engineering
Adsorption
18%
Nodes
18%
Temperature Coefficient
18%
Function Analysis
18%
Pair Distribution
18%
Crystal Structure
18%
Oxygen Evolution Reaction
18%
Sensing Terminal
18%
One Dimensional
18%
Polymeric Chain
18%
Elevated Temperature
18%
Monomer
18%
Probe Point
18%
Thin Films
18%
Temperature Coefficient of the Resistance
10%
Individual Property
9%
Thermal Diffusivity
9%
Precursor Material
9%
Carrier Mobility
6%
Sensing Electrode
6%
Keyphrases
Thermoelectric Materials
18%
Structural Investigation
18%
Operational Stability
18%
Thermal Gradient
12%
Stability Limit
12%
DC Current
12%
Directly Observed
6%
Spatially Resolved
6%
Zn4Sb3
6%
Solid-state Reaction
6%
Diffusion in Solids
6%
Zn Migration
6%
Decomposition Mechanism
6%
Ion Mobility
6%
Material Response
6%
Critical Voltage
6%
Electrochemical Effect
6%
Operando Characterization
6%
Electrical Resistance
6%
Ion Migration
6%
Solid-state Electrolyte
6%
Ion Diffusion
6%
Mixed Ionic-electronic Conductor
6%
Thermal Diffusion
6%
